IBM's new Power4 server processor will offer dual
multiprocessing on a single chip, chew data in 64 bits, and spit it out
at 2GHz when it debuts next year.
First, it was copper (Who 'da thought?). Now with their
new 'low-k dielectric' insulation, IBM engineers promise to speed up all
semiconductors by another 30% as circuits shrink to 0.13 microns and
smaller.
Previously announced in April, IBM is now starting
production of their new silicon-on-insulator (SOI) processors for the
server set. Claiming 30% more speed, 1/3 the power consumption, and a
two-year technology lead on Intel,
SOI and copper combined look like the shape of chips to come.